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Devcon

HP 250 Epoxy, 50 mL, Dev-Pak, Straw

HP 250 Epoxy, 50 mL, Dev-Pak, Straw

Regular price $42.91 USD
Regular price Sale price $42.91 USD
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SKU

SKU:230-14315

High-performance, gap-filling thixotropic paste for structural bonding applications
Superior toughness, impact and chemical resistant
Bonds metals, FRP/SMC composites, phenolics, stainless steel, aluminum, vinyl esters, nylon, PVC, PC, styrenics, wood, and rigid plastics
Excellent gap fill.

Quantity 1EA

Specifications

Adhesive Tensile Shear=3,200 psi
Applicable Materials=Aluminum; Brass; Copper; Galvanized Steel; Most Metals; Steel
Applications=Multi-Purpose
Base Type=Epoxy
Capacity Vol. [Nom]=50 mL
Chemical Compound=Epoxy
Color=Straw
Dielectric Strength=490 V/mil
Elongation [Nom]=25%
Fix Cure Time @ Temp.=6 h @ 72 F
Full Cure Time @ Temp.=7 d @ 72 F
Hardness [Nom]=78 Shore D
Height [Nom]=3 1/4 in
Length [Nom]=7 1/4 in
Material=Thixotropic Paste
Odor/Scent=Low
Packing Type=Dev-Pak
Physical Form=Solid
Ratio=2:1
Resistance=Chlorinated Solvents; Kerosene; Moisture; Water; Weather
Temp. Range [Max]=250 F
Temp. Range [Min]=-67 F
Tensile Strength [Nom]=3,200 psi
Type=Adhesive
Usage=Structural Bonding
Viscosity [Nom]=105,000 cP
Width [Nom]=6 in
Working Time [Nom]=65 min

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